Enhancements    

Patents of Francisco Medina

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication (Inactive)
Issue Date: 01 - 26 - 2021
Application Date: 03 - 14 - 2014
Patent No. 10-2015-7028973 KR South Korea

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication (Inactive)
Issue Date: 01 - 06 - 2021
Application Date: 03 - 14 - 2014
Patent No. 10-2015-7028963 KR South Korea

Extrusion-based additive manufacturing system for 3d structural electronic, electromagnetic and electromechanical components/devices
Issue Date: 08 - 18 - 2020
Application Date: 01 - 04 - 2012
Patent No. 10,748,867

Methods for connecting inter-layer conductors and components in 3d structures (Continuation)
Issue Date: 05 - 19 - 2020
Application Date: 06 - 17 - 2016
Patent No. 10,660,214

Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
Issue Date: 12 - 31 - 2019
Application Date: 03 - 14 - 2013
Patent No. 10,518,490

Electronic Dice (Continuation)
Issue Date: 07 - 02 - 2019
Application Date: 01 - 19 - 2018
Patent No. 10,335,673

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication (Inactive)
Issue Date: 07 - 02 - 2019
Application Date: 03 - 14 - 2014
Patent No. CN105453709A China

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication (Inactive)
Issue Date: 01 - 30 - 2019
Application Date: 03 - 14 - 2014
Patent No. 14770931.5 Europe

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication (Inactive)
Issue Date: 01 - 23 - 2019
Application Date: 03 - 14 - 2014
Patent No. JP 2016-502704 Japan

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication (Inactive)
Issue Date: 06 - 22 - 2018
Application Date: 03 - 14 - 2014
Patent No. CN105409335 China

Electronic Gaming Die
Issue Date: 03 - 06 - 2018
Application Date: 07 - 10 - 2014
Patent No. 9,908,037

Method for Connecting Inter-Layer Conductors and Components in 3D Structures
Issue Date: 08 - 09 - 2016
Application Date: 03 - 14 - 2013
Patent No. 9,414,501

Reticulated Mesh Arrays and Dissimilar Array Monoliths by Additive Layered Manufacturing Using Electron and Laser Beam Melting
Issue Date: 09 - 09 - 2014
Application Date: 05 - 14 - 2010
Patent No. 8,828,311

Hydrogel Constructs Using Stereolithography
Issue Date: 08 - 21 - 2013
Application Date: 04 - 24 - 2006
Patent No. JP5270360 Japan

Hydrogel Constructs Using Stereolithography
Issue Date: 01 - 13 - 2013
Application Date: 04 - 24 - 2004
Patent No. EU1883519 Europe

Methods and Systems for Integrating Fluid Dispensing Technology with Stereolithography (Divisional)
Issue Date: 08 - 28 - 2012
Application Date: 12 - 23 - 2009
Patent No. 8,252,223

Methods for Multi-Material Stereolithography (Divisional)
Issue Date: 06 - 14 - 2011
Application Date: 02 - 09 - 2009
Patent No. 7,959,847

Hydrogel Constructs Using Stereolithography (Continuation)
Issue Date: 06 - 10 - 2011
Application Date: 08 - 24 - 2010
Patent No. 8,197,743

Hydrogel Constructs Using Stereolithography
Issue Date: 08 - 24 - 2010
Application Date: 04 - 22 - 2005
Patent No. 7,780,897

Methods and Systems for Integrating Fluid Dispensing Technology with Stereolithography
Issue Date: 02 - 09 - 2010
Application Date: 03 - 31 - 2005
Patent No. 7,658,603

Multi-Material Stereolithography
Issue Date: 07 - 07 - 2009
Application Date: 07 - 30 - 2004
Patent No. 7,556,490

Methods and Systems for Rapid Prototyping of High Density Circuits
Issue Date: 09 - 02 - 2008
Application Date: 04 - 22 - 2005
Patent No. 7,419,630